Universal X-RAY equipment_X-7100
Stage size：540*540mm
Spatial resolution：5um
Optical magnification：250X
Scope of application：Electronic component/Wire harness/Electronic sensor/Battery protection board/Lithium battery/Fuse
Tube voltage：
X-7100 X-RAY has a wide range of inspection fields and is usually used in the internal structure inspection of electronic components. Common bubble void rate measurement, circuit short circuit and open circuit, solder joint lack of solder, less solder leakage, and foreign body cracks inside.....
specification
Product Introduction
| Model： | X-7100 |
| X-Ray tube type | Enclosed type |
| Spatial resolutiaon | 5um |
| Light tube voltage | 90KV （Optional 100KV、130KV） |
| Light tube current | 200uA |
| Magnification | Optical magnification 250X, system magnification 1000X |
| Digital flat panel detector resolution | 1536*1536 px |
| Digital flat panel detector density value | 16bit （655） |
| Image speed | 20 (FPS) |
| Detector rotation angle | 60° |
| Stage size | 540*540mm |
| Detection speed | 360° |
| X-Y strokee | 800*1000mm |
| Examination range | 0.02-45cm2 |
| Machine size | 1100*1360*1750mm(L*W*H) |
| Machine weight | 950KG |
| operating system | WINDOWS 10 |
| Power supply/power | AC110-220V 50-60HZ 1200W |
| Radiation safety test | <1 uSV/H |
XC-3100 is a new type of X-ray spotting machine, used to quickly count the reel materials in the SMT industry, with an accuracy of 99.99% and a four-reel inspection speed of only 7-14S.
The X-7900 electronic semiconductor inspection equipment can be used to detect integrated circuit chip semiconductors with high precision testing, such as BGA, IGBT, flip chip and PCBA module welding, LED, photovoltaic etc.; Widely used in industrial manufacturing field, such as automobile parts, casting testing, quality testing for pressure vessel and pipe welding; Can detect defects of various types of battery, such as power battery, cylinder, soft packaging, square battery and laminated board.
X-7100 X-RAY has a wide range of inspection fields and is usually used in the internal structure inspection of electronic components. Common bubble void rate measurement, circuit short circuit and open circuit, solder joint lack of solder, less solder leakage, and foreign body cracks inside.....